Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.
Ultra Tec adds improved optics to ASAP-1 IPS for accurate tool positioning
Applied Materials collaborates with Samsung and PSK for advanced patterning
Applied Materials Inc., Santa Clara, Calif., announces that it collaborated with Samsung Electronics Co. Ltd. and Korea’s PSK Inc. to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
Germanium replaces silicon in CMOS device
Researchers at Purdue University, West Lafayette, Ind., have created the first modern complementary metal-oxide-semiconductor device in which germanium is the semiconductor instead of silicon.
ESI laser drilling tool designed for semiconductor substrate fabrication
Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.
Auto show features 3D-printed muscle car
With a 3D printed twist on an automotive icon, the Department of Energy’s Oak Ridge National Laboratory, Tenn., showcased additive manufacturing research at the 2015 North American International Auto Show in Detroit.