Craic Technologies, San Dimas, Calif., announces Spectral Surface Mapping (S2M) software for its UV-visible-NIR microspectrophotometers.
Software enables sub-micron spatial resolution for microspectrophotometers
ESI announces versatile laser micromachining platform
Electro Scientific Industries Inc., Portland, Maine, announces the µFlex Series multi-axis precision laser micromachining platform.
Applied Materials develops advanced patterning solution for memory devices
Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.
Imec, Coventor partner to advance CMOS process development
Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec’s 10- and 7-nm processes.
Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems initiative
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.