Researchers at Università Cattolica, Italy, have developed a new type of advanced microscope called wide-field coherent multidimensional microscopy, which uses a sequence of ultrashort light pulses to study the behavior of high-tech materials.
Researchers at the Fermilab-led SQMS Center in Batavia, Illinois, have completed a first-of-its-kind study linking materials and their structures, including surfaces, interfaces, and geometries, to variations in quantum device performance.
3D-Micromac AG, Germany, highlighted its microPREP L laser-based sample preparation system for advanced semiconductor packaging failure analysis and quality assurance, enabling targeted defect access across samples ranging from individual dies to full 300-mm wafers and system-level boards.
Synopsys, Sunnyvale, Calif., and OpenAI, San Francisco, Calif., have partnered to bring together OpenAI’s advanced AI capabilities with Synopsys’ industry-leading electronic design automation tools and agentic AI capabilities to revolutionize the design of semiconductors.
Hamamatsu Photonics, Japan, developed the iPHEMOS-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, high bandwidth memory, 2.5D/3D packages, and large-scale semiconductor packages.
