SEMI, San Jose, Calif., announces that 19 new fabs and lines are forecast to begin construction in 2016 and 2017, according to the latest update of the SEMI World Fab Forecast report.
FEI launches three tools for next-generation semiconductor failure analysis
FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.
Thermo Fisher Scientific acquires FEI Company for $4.2 billion
Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.
Large-area ALD system enables encapsulation of large sheets of organic components
Picosun Oy, Finland, has developed atomic layer deposition (ALD) equipment specifically designed for large-area flexible electronics encapsulation.
IBM scientists achieve phase-change memory breakthrough
IBM Research, Schenectady, N.Y., reports that its scientists have demonstrated reliably storing three bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).