The November/December issue of Advanced Materials & Processes magazine has an editorial focus on Testing and Characterization.
Advanced Materials & Processes, Volume 181, Issue 8, November/December 2023 (ASM International)
Thermo Fisher Scientific announces new electron beam fault localization system for analyzing advanced logic semiconductors
Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.
Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC
Samsung Electronics Co., South Korea, the world’s largest memory chipmaker, plans to unveil an advanced three-dimensional chip packaging technology to compete with foundry leader Taiwan Semiconductor Manufacturing Company.
United Safety launches new lithium-ion battery failure detection sensor
United Safety & Survivability Corporation, Exton, Pa., a global leader in advanced safety solutions, launched its latest innovation, a groundbreaking lithium-ion battery failure detection sensor that could help prevent electric vehicle fires before they happen and sets a new standard in safety for electric vehicles across industries.
Materials scientist wins award for improving the reliability of electrical contacts in cars
Materials scientist Frank Mücklich, Professor of Functional Materials at Saarland University, Germany, has developed a laser surface texturing procedure that makes the surfaces of electrical contacts more stable and more efficient.