Hitachi High-Tech Science Corporation, Japan, launched a new product in the NEXTA series, the DMA200 a dynamic mechanical analyzer for advanced materials development and product quality control.
A team of researchers from the Ultramicroscopy Research Group at Trinity College at the University of Dublin, Ireland, completed the installation of a world-first User Adjustable Pole-piece (UAP) transmission electron microscope lens.
Researchers at North Carolina State University, Raleigh, N.C., have created a robot called RoboMapper that can rapidly identify new perovskite materials with improved stability and solar cell efficiency and is capable of conducting experiments more efficiently and sustainably to develop a range of new semiconductor materials with desirable attributes.
The U.S. Department of Defense has awarded GlobalFoundries, Malta, New York, a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
The U.S. National Science Foundation announced 24 research and education projects to 47 institutions with a total investment of $45.6 million — including funding from the “CHIPS and Science Act of 2022” — to enable rapid progress in new semiconductor technologies and manufacturing as well as workforce development.
