Oxford Instruments, Concord, Mass., announces that it has developed a silicon carbide via plasma etch process based on its PlasmaPro100 Polaris etch system.
Oxford Instruments develops SiC via etch for RF devices
Qualcomm Technologies opens semiconductor test facility in Shanghai
Qualcomm Inc., San Diego, announces the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the WGQ free-trade zone in Shanghai, and its first venture into providing manufacturing services for semiconductors.
Linde invests $5.4 million in Taiwan R&D Center
The Linde Group, Murray Hill, N.J., has invested approximately $5.4 million to establish a Linde Electronics R&D Center in Taiwan to support local customers and development partners with its state-of-the-art analytical and product development laboratory.
Applied Materials extends R&D partnership with Singapore’s Institute of Microelectronics
Applied Materials Inc., Santa Clara, Calif., and the Institute of Microelectronics, Singapore, announce a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.
Wafer shipments forecast to increase in 2016, 2017, and 2018
SEMI, San Jose, Calif., recently completed its annual silicon shipment forecast for the semiconductor industry, providing an outlook for the demand in silicon units for the period 2016–2018.