Indium Corp., Utica, N.Y., has developed BiAgX high-melting-point lead-free solder paste for high-reliability electronics assembly.
Indium’s BiAgX high-melting-point lead-free solder paste designed for high reliability
Modular microscope enables fast substrate thickness measurement
UltraTec Manufacturing Inc., Santa Ana, Calif., offers the ICis modular microscope, which allows for fast substrate thickness measurements of backside thinned and polished samples.
Shimadzu opens Solution Center at North American headquarters
Shimadzu Scientific Instruments , Columbia, Md., has opened a new 4100-square-foot Solution Center in Columbia.
Oxford Instruments acquires Andor
Oxford Instruments, U.K., recently acquired Andor, South Windsor, Conn., a market leading supplier of high performance cameras, microscope systems, and software for the physical science and life science industries.
Heraeus introduces thick print copper paste system for circuits 20 to 350 microns thick
Heraeus Precious Metals, West Conshohocken, Pa., introduces a thick print copper paste system for power electronic applications where excellent reliability, thermal conductivity, and robust thermal cycling performance are required.