SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.
SEMI, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.38 billion in orders worldwide in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02.
Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.
Mentor Graphics Corp., Wilsonville, Ore., announces that the Shanghai ZhangJiang Institute has adopted the Veloce 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.
Leica Microsystems, Germany, launches the Leica DCM8 for nondestructive three-dimensional surface profiling.
