The May 2026 issue of Electronic Device Failure Analysis includes: Electrical Fault Localization of Interconnect Via Chains; Inspection and Metrology Challenges in Hybrid Bonding; Failure Analysis Roadmap: Die-Level Council Update; and Advanced Fault Isolation of USB2 ESD Failures.
In this video, see the Dragonfly G5—Onto Innovation’s advanced 2D/3D macro defect inspection system delivering high sensitivity, fast imaging, and AI-powered defect detection for semiconductor manufacturing.
In microgravity environments, liquids behave differently, crystal structures can form more uniformly and impurities do not settle in the same way they do under Earth’s gravity. These changes may allow scientists and aerospace engineers to manufacture certain materials with properties that are difficult to achieve in conventional factories.
Australian scientists at the University of Melbourne have made a significant leap forward in energy storage technology by developing and testing the world’s first proof-of-concept quantum battery.
