Imec, Belgium, and Coventor, Cary, N.C., announce the expansion of a joint development project to explore process variation issues in 7 nm semiconductor technology.
Imec, Coventor collaborate to optimize 7 nm semiconductor manufacturing
Cardiff University and IQE partner to build center for compound semiconductor research
Cardiff University and IQE plc, both of Wales, announce a joint venture to build the Compound Semiconductor Centre, which has the goal of developing and commercializing next-generation compound semiconductor technologies.
On Semiconductor to acquire Fairchild Semiconductor for $2.4 billion
On Semiconductor Corp., Phoenix, Ariz., and Fairchild Semiconductor Intl. Inc., South Portland, Maine, announce plans for On Semiconductor to acquire Fairchild for $20.00 per share in an all cash transaction valued at approximately $2.4 billion.
Copper oxide coated microporous foam heat sinks enable higher emissivity
Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.
Helios G4 HX designed for high-throughput failure analysis of semiconductors
FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry’s highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.