FEI Co., Hillsboro, Ore., has acquired DCG Systems, Fremont, Calif., a leading supplier of electrical fault characterization, localization, and editing equipment for a wide range of semiconductor and electronics manufacturers.
Semiconductor testing method efficiently measures uniformity of conductivity
Northwestern University, Evanston, Ill., reports that a new method of semiconductor characterization that is more accurate, efficient, and simple than existing methods has been developed by its researchers.
Vanadium dioxide thin films added to transistors improve energy efficiency
Scientists at Penn State University, University Park, have reportedly discovered a way to incorporate vanadium dioxide thin films into transistors and memory devices to improve energy efficiency and robustness.
Ultratech introduces Superfast 4G+ in-line wafer inspection system
Ultratech Inc., San Jose, Calif., introduces the Superfast 4G+ in-line 3D topography wafer inspection system featuring coherent gradient sensing technology that enables a single wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost.
Safer “Rainbow flame” classroom demo
A chemistry demonstration commonly known as the “rainbow flame” experiment has resulted in a number of serious injuries in classrooms in recent years.