Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.
Suss wafer bonder supports substrates with wafer size up to 200 mm
ARM joins global research collaboration for continued scaling of semiconductors
Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.
Jeol SEM features expanded EDS analysis, hi-res imaging, and ports for multiple detectors
Jeol USA, Peabody, Mass., introduces the JSM-IT100 scanning electron microscope, which features expanded EDS analysis capabilities and ports for multiple detectors.
Global semiconductor sales increase by 1.5% in third quarter
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.
One Minute Mentor: Effect of Ledeburite Carbides
For ledeburitic tool steels (typical 8-12%-Cr cold-work tool steels and high-speed steels) the interaction of carbides with the matrix must be taken into account, especially when these carbides are strongly oriented after plastic deformation (rolling, forging) of the pre-material.