Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
Microindentation offers hope for high-throughput testing
Researchers at the Georgia Institute of Technology have developed a protocol using multi-scale modeling to determine tensile yield strength from microindentation tests. Micro indentation offers all the advantages of a high-throughput measurement technique.





