Ultra Tec Mfg. Inc., Santa Ana, Calif., introduces its Ultracollimator module for the Ultrapol Advance Precision lapping and polishing machine.
Laser-based illumination module offers up to four times tilt alignment accuracy
NanoSteel builds fully dense additively manufactured parts with hardness gradient
The NanoSteel Co., Providence, R.I., announces the expansion of the company’s additive manufacturing material capabilities to support metal 3D printing of complex high hardness parts.
Applied Materials and Tokyo Electron unveil new company name
Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., announce that the name of their combined company is Eteris (ETERnal Innovation for Society).
System-on-a-chip design reduces failure rate by a factor of nine
Chalmers University of Technology, Sweden, announces that the European Union’s DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.
Off-axis silicon carbide substrate layering builds better semiconductors
Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.