FEI Corp., Hillsboro, Ore., offers the Helios PFIB for large area deprocessing to enable electrical fault isolation of advanced process ICs, and advanced failure analysis of 3D packages.
Intel Corp., Santa Clara, Calif., has introduced the 4th generation Intel Core processor family, with power levels as low as 6 watts, up to 50% improvement in battery life over the previous generation in active workloads, and two to three times improvement in standby battery life.
Bruker, Billerica, Mass., introduces the NanoForce nanoindenting and nanomechanical testing system.
Cadence Design Systems Inc., San Jose, Calif., has developed the Cadence Perspec System Verifier platform, a software-driven system-on-chip (SoC) verification solution.
In 2011, President Obama launched a Materials Genome Initiative (MGI), a broad, cross-sector effort to work toward doubling the pace of advanced materials discovery, innovation, manufacture, and commercialization in the United States.
