Finetech, Gilbert, Ariz., has been selected by the Georgia Tech Packaging Research Center (PRC), Atlanta, to provide its semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine-pitch copper interconnect and assembly technology.
Sematech, Albany, N.Y., announces that its researchers have reached a significant milestone in reducing to zero the defects generated by tools from the multi-layer deposition of mask blanks for extreme ultraviolet lithography.
Cascade Microtech Inc., Beaverton, Ore., has developed the CM300 Probe System, which automates on-wafer device measurements and enhances device and process characterization and modeling by capturing the true electrical performance of devices, thus enabling hands-off productivity.
Bruker Corp., Madison, Wis., announces the world’s first FTIR spectrometer that covers the complete mid and far Infrared/THz spectral ranges in one step with no gaps.
Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.
