Researchers at the Fraunhofer Institute for Nondestructive Testing IZFP, Germany, have developed an ultrasonic phased-array instrument that enables them to produce high-resolution 3D images.
Ultrasonic phased array produces high-resolution 3D images
Zeiss 340 and 540 FIB-SEMs feature high-speed processing observed in real time
Carl Zeiss Microscopy, Peabody, Mass., introduces the first system of the new Crossbeam 340 and 540 series FIB-SEMs for nanotomography and nanofabrication.
SUSS MicroTec launches projection scanner for advanced packaging
SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).
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Directed self-assembly developed to advance semiconductor manufacturing
Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.