Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper’s ability to dissipate heat by 25%.
Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., report that they have received notice from the Committee on Foreign Investment in the United States (CFIUS) that there are no unresolved national security issues relating to the proposed business combination announced last year.
Researchers at the Berkeley Lab Molecular Foundry report that they have developed rhenium disulfide, a semiconductor that functions electronically as if it were a 2D monolayer even as a 3D bulk material.
Work from Helmholtz-Zentrum Berlin für Materialien and Energie (HZB), and University of Münster, both in Germany, shows how new phases in a nickel-based alloy form and evolve, providing clues to how high-performance alloys could be improved.
