Advanced Semiconductor Engineering Inc., Taiwan, and Cadence Design Systems Inc., San Jose, Calif., announce that they have collaborated to release a System-in-Package (SiP) EDA solution that addresses the challenges of designing and verifying Fan-Out Chip-on-substrate multi-die packages.
Craic Technologies, San Dimas, Calif., has added Raman microspectroscopy to its 20/30 Perfect Vision microspectrophotometer.
Olympus, Japan, has developed the MX63/MX63L microscopes, which provide MIX observation technology that produces unique observation images by combining darkfield with another observation method, such as brightfield, fluorescence, or polarization.
Edax Inc., Mahwah, N.J., introduces the latest revision of its Apex analysis software, which was developed to ensure high-quality results that accelerate and simplify compositional analysis.
Jeol USA, Peabody, Mass., offers the JSM-IT500HR InTouchScope, a scanning electron microscope that is said to deliver high-resolution field emission SEM performance with the ease of operation of Jeol’s Tungsten SEMs.
