IC Insights Inc., Scottsdale, Ariz., reports that, with the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates.
Samsung Electronics Co. Ltd., South Korea, announces that 8nm FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
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Hamamatsu Photonics KK, Japan, announces an agreement to acquire Energetiq Technology Inc., Woburn, Mass., for its laser-driven light sources and extreme-ultraviolet light sources.
Oxford Instruments NanoScience, England, announces it will jointly develop high-precision scanning probe microscope products based on TeslatronPT, the Cryofree superconducting magnet system from Oxford Instruments, in collaboration with CASmF Science and Technology Limited in China.
