Constellium N.V., New York, introduces HSA6, a new generation of high-strength 6000-series alloys for extrusion-based automobile crash management systems, body-in-white structural components, and battery enclosures.
Oxford Instruments, Concord, Mass., introduces a real-time navigation and imaging system for the SEM that helps users interactively explore samples based on video-rate X-ray maps colored by element rather than the black and white electron image alone.
Hitachi High-Technologies Corp., Tokyo, announces the development of an all-new high-performance Ethos FIB-SEM based on a newly developed magnetic/electrostatic compound lens that enables it to deliver advanced imaging performance resolving sub-nanometer features in high contrast for low-voltage SEM applications.
Jeol USA, Peabody, Mass., introduces the newest addition to the Jeol InTouchScope series SEMs, the JSM-IT500HR, which features a high-brightness, long-life emitter with stable probe current.
Coventor Inc., Cary, N.C., announces the availability of SEMulator3D 6.1, the latest version of its semiconductor virtual fabrication platform.
