Suss MicroTec, Germany, has launched its new generation of the fully automated ACS300 Gen3 platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.
Bruker’s Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.
Engineers from the Applied Electromagnetics Group at the University of California San Diego report that they have fabricated the first semiconductor-free, optically controlled microelectronic device.
Astronics Test Systems, East Aurora, N.Y., introduces its ATS 5034 System-Level Test Platform that improves production efficiency and greatly reduces costs by processing up to 396 devices simultaneously.
Samsung Electronics Co. Ltd., Japan, announced at its Device Solutions America headquarters in San Jose, Calif., that it is expanding its advanced foundry process technology products with the fourth-generation 14-nm process and the third-generation 10-nm process.
