Researchers at the University of Southern California have unveiled a new memristor memory device that continues to operate at 700 degrees Celsius (~1300 degrees Fahrenheit), marking it as the most robust high-temperature memory technology ever demonstrated.
Researchers at Rice University, Houston, Texas, have developed a 3D-printing process that utilizes focused microwaves to selectively heat functional inks, enabling the direct integration of electronics onto temperature-sensitive materials such as biopolymers and living biological tissue without damaging the underlying substrate.
Camtek Ltd., Israel, a leading developer and manufacturer of inspection and metrology equipment for the semiconductor industry, has signed a definitive agreement to acquire Visual Layer, a Tel Aviv-based AI company specializing in visual analytics.
Researchers at The University of Osaka, Japan, have developed an outdoor wireless EEG transmission system using energy harvested from the temperature difference between the human body and surrounding air, even under hot summer conditions.
Bruker Corporation, Billerica, Mass., announced accelerated development of its photothermal AFM-IR spectroscopy capabilities to address research challenges facing the semiconductor industry as device architectures continue to shrink and systems become increasingly more complex.
