FEI Co., Hillsboro, Ore., introduces three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing: the Helios G4 DualBeam EXL, The Metrios DX TEM, and the ExSolve 2 WTP.
Thermo Fisher Scientific Inc., Waltham, Mass., announces that it is to acquire FEI Co., Hillsboro, Ore., for approximately $4.2 billion.
Picosun Oy, Finland, has developed atomic layer deposition (ALD) equipment specifically designed for large-area flexible electronics encapsulation.
IBM Research, Schenectady, N.Y., reports that its scientists have demonstrated reliably storing three bits of data per cell using a relatively new memory technology known as phase-change memory (PCM).
Protochips, Morrisville, N.C., has released its Fusion multi-functional heating and electrical system for in-situ electron microscopy.
