Materion Brush Beryllium & Composites, a Materion Corporation business, Elmore, Ohio, announces that it has qualified and entered into a strategic manufacturing and marketing partnership with Aristo Cast Inc.
The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.
Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel’s world-class package and assembly capabilities and Altera’s leading-edge programmable logic technology.
Researchers at the University of California at Santa Barbara have developed an erbium-antimony semiconductor of nearly perfect quality that can manipulate light energy in the mid-infrared range.
Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.
