Ultratech Inc., San Jose, Calif., has shipped its first LSA201 laser spike anneal system to a leading integrated device manufacturer. The LSA201 is built on a new platform that enables precise control over the gases that surround the wafer during processing. At the customer’s facility, the system will be used to develop leading-edge logic technology, mainly focusing on FinFETs.
ASB to modernize its Mesta roll grinder
ASB Industries, Barberton, Ohio, announces that its Heavy Duty Grinder, which is five feet in diameter and 24 feet long, will be modernized at a cost of approximately $400,000. Rebuild will begin in June and is expected to take approximately six months. This major capital investment will allow two-axis grinding for complex roll crowns with extreme accuracy and efficiency. Thermal Spray surfacing materials require different grinding media to achieve critical surface finishes.
Mentor Graphics 3D-IC flow solutions validated for true 3D stacking integration
Mentor Graphics Corp., Wilsonville, Ore., announces that its 3D-IC flow solutions have been validated by TSMC with a true 3D stacking test vehicle for TSMC’s 3D-IC Reference Flow. The flow expands support from silicon interposer offerings to include TSV-based, stacked die designs.
Alcoa expands production of aluminum-lithium alloys for aerospace products
Alcoa Aerospace, Pittsburgh, announces that it has upgraded and expanded aluminum-lithium casting capacity at the Kitts Green plant in England. It has also expanded capacity by 30% at its Technology Center in Alcoa Center, Pa. The third phase of the expansion is a new $90 million facility under construction adjacent to the plant in Lafayette, Ind., that will provide an additional 20,000 metric tons of aluminum lithium.
Fully integrated MBE system designed for compound semiconductor R&D
Veeco Instruments Inc., Plainview, N.Y., introduces the GENxplor Molecular Beam Epitaxy (MBE) deposition system, the industry’s first fully-integrated MBE system for the compound semiconductor R&D market. It builds epitaxial layers on substrates up to 3 in. diameter and is ideal for cutting edge research on a wide variety of materials including GaAs, nitrides, and oxides.