A research team from the Department of Energy’s Oak Ridge National Laboratory has developed the Rapid Object Detection and Action System (RODAS), a unique method that combines imaging, spectroscopy, and microscopy to observe changes in materials at the atomic level. This technique offers new opportunities for understanding and developing advanced materials for quantum computing and […]
New soft material charges like batteries, can be woven into fabrics, make devices
Scientists from Northwestern University have developed highly energy-efficient, biocompatible materials made of tiny, flexible nano-sized ribbons that can be charged like a battery to store energy or record digital information. These sustainable materials could lead to new types of ultralight electronic devices, reducing the environmental impact of electronic manufacturing and disposal. The study highlights potential […]
QuantumDiamonds launches QD m.0: first commercial quantum device for semiconductor chip failure analysis
QuantumDiamonds GmbH, Germany, a pioneer in quantum sensing technology, released the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis, using diamond-based quantum microscopy to detect and localize faults in integrated circuits with high precision.
Materials Analysis Technology releases a MOU with SGS
Materials Analysis Technology Inc., Taiwan, and Swiss SGS Taiwan Ltd. signed a memorandum of understanding with the goal of providing comprehensive ISO 26262 functional safety product certification services, AEC-Q automotive electronic component reliability verification services, and soft error rate assessment and analysis in the automotive semiconductor and electronic component industries in Taiwan.
Faraday enhances 3D-IC design service with Ansys multiphysics analysis
Faraday Technology Corporation, Pittsburgh, Pa., a leading application specific integrated circuits (ASIC) design service and IP provider, is expanding its use of Ansys technology to enhance its capabilities in developing advanced designs for multi-die 2.5D/3D-ICs — critical for artificial intelligence (AI), IoT, and 5G applications. With support from Ansys, Faraday will empower its customers to […]






