A team of academic and enterprise researchers at Penn State has developed a synthesis process to produce a “rust-resistant” coating with additional properties ideal for creating faster, more durable electronics.
Cornell University researchers, Ithaca, N.Y., in collaboration with a team at the Polish Academy of Sciences, have developed the first dual-sided – or “dualtronic” – chip that combines photonic and electronic functions simultaneously, an innovation that could shrink the size of functional devices, make them more energy efficient and reduce manufacturing costs.
Researchers at the University of Illinois Urbana-Champaign discovered that ordered defect pairs in solution-deposited semiconductors lead to record-high transistor performance, challenging conventional wisdom in semiconductor manufacturing.
The November 2024 issue of Electronic Device Failure Analysis includes: Celebrating 50 Years of ISTFA; Four-dimensional STEM: Part III, Ptychography; Nondestructive 3D X-ray Microscopy Speeds Throughput; Specimen Thinning by Argon Ion Beam Milling; and TEM Samples with PFIB and STEM EBIC.
This video from UNL Astronomy describes the phase changes for shape memory alloys.
