Penn State’s College of Engineering and Ontario Tech University’s Faculty of Engineering and Applied Science (FEAS) have officially established a memorandum of understanding (MOU). This agreement aims to harness the combined expertise of both institutions in the fields of engineering and applied sciences. The MOU was initiated by Akhlesh Lakhtakia, Evan Pugh University Professor and […]
TESCAN GROUP, a.s., Czech Republic, completed its acquisition of TESCAN KOREA, Ltd. and Daeil Microanalysis Laboratory, after two decades of successful collaboration consolidating efforts to better serve the Korean customers and market, particularly in the semiconductor domain.
inTEST Corporation, Mt. Laurel, N. J., launched the Acculogic patent-pending hover sense non-contact technology for electric vehicle battery testing, representing a significant leap forward in validating the quality and reliability of EV battery interconnects.
ElevATE Semiconductor, San Diego, Calif., and GlobalFoundries (GF) announced a manufacturing partnership for high-voltage chips produced at GF’s facility in Essex Junction, Vermont.
Scientists at Los Alamos National Laboratory, N. M., and Tel Aviv University, Israel, have achieved a breakthrough in material science with the creation of “Chaco,” a revolutionary metamaterial named after the historical site Chaco Canyon in New Mexico.
