Today’s technology, from computer chips to camera image sensors, relies heavily on silicon semiconductors, which have been shrinking for decades. However, physical limitations will soon halt further advancements. Consequently, scientists and engineers are developing a new generation of technology based on quantum mechanics. Electrons in “quantum materials” exhibit unique behaviors, such as magnetism and superconductivity, […]
LIFT, a Department of Defense-supported national advanced materials manufacturing innovation institute, has opened the Advanced Metallic Production and Processing (AMPP) Center in Detroit’s Corktown district. This facility will enhance the U.S. industrial base by accelerating the design, development, and deployment of novel metallic materials, addressing a critical gap in defense manufacturing. By producing metals across […]
In this video, see the new Enhanced Remote Tools for Bruker AXS service, which combines advanced software and hardware with augmented reality technology to enable faster, more efficient initial problem diagnosis and technical support by connecting customers’ smart devices with global helpdesk engineers.
Researchers from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, developed a high-pressure liquid seal technique that eliminates bubble formation in PDMS-based PCR chips by proving that water vapor diffusion—not air expansion—is the main cause of bubbles.
Celera, Alameda, Calif., the leader in fully automated, AI-enhanced analog design, is now sampling the first ever analog IC completely designed by an autonomous software platform. Using Celera’s ChipHUB platform, the company improved engineering productivity by 10x, allowing the design of a high-performance buck (DC-to-DC) converter from specification to manufacturing release in a matter of […]
