Siemens, Germany, opened its $190 million electrical equipment manufacturing facility in Fort Worth, Texas. A part of the company’s Smart Infrastructure business, the site is responsible for creating reliable and efficient electrical equipment such as low-voltage switchboards necessary to meet the demand from the booming data center market and America’s AI growth. The 500,000-square-foot facility […]
Master Bond Inc., Hackensack, N.J., released its newest product, Master Bond EP29LPSPND-3, a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications.
University of Michigan engineers developed a modified manufacturing process for electric vehicle batteries—using a stabilizing electrode coating and microscale channels—that could enable high ranges and fast charging in cold weather, solving problems that are turning potential EV buyers away.
Minnesota-based startup Maxwell Labs has entered into a cooperative research and development agreement with Sandia and the University of New Mexico to demonstrate laser-based photonic cooling for computer chips that may help save energy and water.
The May 2025 issue of Electronic Device Failure Analysis includes: Background and History of the U.S. Chips Act; Silicon Photonic FA using Near Infrared Microscopy; An Ion Microscope for Imaging and SIMS Nanoanalytics; and Solder Joints under Varying Temperatures and Salinities.
