XwinSys, Carefree, Ariz., recently launched the Onyx, a novel in-line and nondestructive hybrid metrology system that uniquely integrates advanced XRF with 2D and 3D optical technologies.
FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world’s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.
Bruker Corp., Billerica, Mass., Germany, announces that multiple leading logic and foundry manufacturers have selected Bruker’s JVX7300LSI X-ray metrology system to support their ramp and development for 10 nm and 7/5 nm technology nodes.
Cadence Design Systems Inc., San Jose, Calif., announces that its implementation and signoff tools have achieved certification on the Intel third-generation 10 nm tri-gate process for customers of Intel Custom Foundry.
Hitachi High-Tech, Schaumburg, Ill., has developed the 9000 Conductor Etch Series to support next-generation devices at 20 nm and below that require double-patterning, 3D structures, and complex, high-precision processes.
