Siemens AG, Munich, and Mentor Graphics, Wilsonville, Ore., announce that they have entered into a merger agreement under which Siemens will acquire Mentor for its electronics IC and systems design, simulation, and manufacturing solutions.
Optotherm, Sewickley, Pa., recently developed the IS640 radiometric infrared camera designed for thermographic applications requiring high sensitivity, resolution, and accuracy.
Suss MicroTec, Germany, has launched its new generation of the fully automated ACS300 Gen3 platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.
Bruker’s Nano Surfaces Division, San Jose, Calif., announces a nanoscale scratch option for its NanoForce Nanomechanical Testing System.
Engineers from the Applied Electromagnetics Group at the University of California San Diego report that they have fabricated the first semiconductor-free, optically controlled microelectronic device.
