Fort Wayne Metals, Fort Wayne, Ind., manufactures premium medical grade Nitinol ASTM F2063 cold drawn coil into finished discrete lengths of superelastic bar typically 6 ft. long. Diameters range from 2.28 to 4.75 mm with either a natural forming oxide, or centerless ground and polished surface. Its Nitinol chemistry exceeds the governing standard. Each medical grade of Nitinol material is comprised of near-equal atomic weight percentage of nickel and titanium.
Two new DualBeams for materials science
FEI Company, Hillsboro, Ore., introduced in July 2013, two new DualBeam systems that feature innovative detection suites that provide high-quality imaging and fast analysis over the broadest range of samples. The new Scios DualBeam is specifically positioned for fast two-dimensional (2D) and three-dimensional (3D) characterization. The Helios NanoLab 660 DualBeam adds capabilities for specialized applications, such as the fabrication of prototypes for nanometer-scale devices.
Aluminum heat treater in U.K. receives first order from South Korea
Alloy Heat Treatment Limited, UK, which says that it is the largest subcontractor for aluminum heat treatments in the country, announces that it has received its first order from South Korea. The order is one of several export orders within the past six months, from new customers in France, Germany, Italy, and Poland.
Bubble lens bends light beams
Using a few tiny liquid bubbles to bend light beams could open the doors for next-generation, high-speed circuits and displays, according to new research at Penn State, State College. To combine the speed of optical communication with the portability of electronic circuitry, researchers use nanoplasmonics-devices that use short electromagnetic waves to modulate light on the nanometer scale, where conventional optics do not work.
EAG launches electronics system failure analysis service
Evans Analytical Group (EAG), Santa Clara, Calif., has launched a comprehensive electronics system failure analysis service. It is now one of the only companies to focus on the entire system, from electronics to materials, all the way down to failure mechanisms at the IC transistor level. The service includes both electrical testing and materials characterization, using the latest high-resolution imaging and electrical localization tools.