Cadence Design Systems Inc., San Jose, Calif., offers a foundry-proven IC packaging design and analysis solution for advanced fan-out Wafer-Level Chip Scale Packaging (WLCSP) and 2.5D interposer-based designs.
Oxford Instruments, has launched the Aztec One XT system, an ideal solution for those who want to perform a complex task such as EDS as quickly and as easily as possible.
Imec, Belgium, announces the opening of its new 4000-square-meter cleanroom facility dedicated to scaling IC technology beyond 7nm, bringing the total floor space of its semiconductor research cleanrooms to 12,000 square meters.
IC Insights, Scottsdale, Ariz., recently released its new “Global Wafer Capacity 2016-2020” report showing that, as of December 2015, Taiwan is now the global leader in wafer capacity with nearly 22% of worldwide IC capacity installed in the country.
IHS Inc., Englewood, Colo., reports that the emerging market for silicon carbide and gallium nitride power semiconductors is forecast to pass the $1 billion mark in five years, energized by demand from hybrid and electric vehicles, power supplies, and photovoltaic inverters.
