Cadence Design Systems Inc., San Jose, Calif., and Arrow Electronics, Centennial, Colo., announce a collaboration that will bring integrated design tools to engineers, helping them accelerate the pace of new product development and get products to market faster and cheaper.
Orbotek Ltd., Israel, has received an order for seven Emerald UV laser drilling systems to drill smaller, high-quality “via” openings in multi-layer ceramic-based IC substrates for next-generation applications.
As shown schematically in the graph, high-temperature hardness is made possible only by a very important straightening mechanism: secondary hardening, promoted by the precipitation of fine alloy carbides.
This is an in-depth look at how robotics can prevent soldiers from dying in battle.
Cornell University, Ithaca, N.Y., the University of Notre Dame, South Bend, Ind., and the semiconductor company IQE, Cardiff, Wales, put together an engineering team that has created gallium nitride (GaN) power diodes capable of serving as building blocks for future GaN power switches.
