Orbotek Ltd., Israel, has received an order for seven Emerald UV laser drilling systems to drill smaller, high-quality “via” openings in multi-layer ceramic-based IC substrates for next-generation applications. The customer is a Japanese company that produces a range of components used in applications such as mobile phones, home appliances, automotive systems, and healthcare devices.
Orbotech’s Emerald systems were selected for their ability to support mass production of ceramic-based IC substrates while maintaining throughput, accuracy, and quality. Ceramic packaging is often used for very small form factor devices and to ensure RF performance support, which require production tools. The small size and the stringent performance requirements of ceramic designs demand a system that is able to drill extremely small via holes consistently and accurately.
“The worldwide demand for smaller and sleeker electronic devices with higher performance capacity continues to increase,”commented Yair Alcobi, President, Orbotech Asia East. “Orbotech’s solutions enable manufacturers to develop next-generation electronic devices in smaller form factors, and offer exceedingly high accuracy with very attractive cost of ownership. This customer’s follow-on order for additional Emerald systems validates the effectiveness of this cutting edge solution and affirms our successful collaboration in providing optimal production tools to meet customers’ needs.”
Orbotech’s Emerald series UV Laser Drilling solutions simultaneously drill eight areas on a panel through patented Multi-Path Technology. High-power UV laser drilling achieves the best registration accuracy in the market. The Emerald series supports below 20 μm via drilling through ABF, polyimide, ceramic, resin, mold compounds, metal and solder resist substrates with no residue or damage to the bottom of the via, and no undercut.
