In this video from MIT, see the insect-sized jumping robot that leaps over tall obstacles and navigates rough terrain using far less energy than similar aerial robots, while carrying about 10 times more payload-opening the door to exciting new applications.
iST launches Global Smart Reliability Center to accelerate front-end validation for AI and EV applications
Integrated Service Technology Inc., Taiwan, a leading provider of electronic product verification and analysis services, launched its Global Smart Reliability Center, developed in response to the growing demand for early-stage reliability testing in AI, high-performance computing, and electric vehicle applications.
Ansys strengthens collaboration with TSMC on advanced node processes certification and 3D-IC multiphysics design solutions
Through continued collaboration with TSMC, Ansys, Canonsburg, Pa., announced enhanced AI-assisted workflows for radio frequency design migration and photonic integrated circuits, and new certifications for its semiconductor solutions.
Sigray unveils the Apex-Hybrid: a breakthrough 3D x-ray system for failure analysis and electronics reverse engineering
Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
Semiconductor takes an unconventional path from insulator to metal
Scientists at the University of Tennessee, Knoxville, recently discovered that Mn3Si2Te6 changes from an insulator to an electrically conductive metal when exposed to a magnetic field.