Alex Lathem, a graduate student at Rice University, has launched Pattern Materials, a startup focused on revolutionizing graphene production by making it faster, more affordable, and scalable. The company leverages Lathem’s proprietary laser-induced and flash graphene technologies, which enable the rapid creation of graphene and carbon nanotube-like patterns in a single step. These advanced materials, […]
Researchers at the University of Toronto Engineering have developed a new multimodal AI tool that could significantly accelerate the application of newly discovered materials. Led by Professor Seyed Mohamad Moosavi, the team’s study introduces an AI system capable of predicting how a material might perform in real-world conditions from the moment it is created—helping ensure […]
The August 2025 issue of Electronic Device Failure Analysis includes: Electrical Resistivity and Residual Stress in Sputtered ITO Films; CAD Methods for Cross-Domain FA in Advanced SIP Architectures; Characterization of Yield-Killing Defects in Micro-LED Wafers; and Systematically Defocusing the Ion Beam for FIB Workflows.
The Integrated Electronics Engineering Center at Binghamton University research that partners with industry to advance electronics manufacturing has been re-designated by New York state as a Center for Advanced Technology, receiving $1 million in annual funding for the next decade.
Siemens, Germany, is equipping its EDA tools with secure, advanced generative and agentic AI—including integration with NVIDIA NIM microservices and Nemotron models—to boost productivity, accelerate chip and PCB design innovation, and transform development workflows from concept to verification.
