Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., announce that the name of their combined company is Eteris (ETERnal Innovation for Society).
Applied Materials and Tokyo Electron unveil new company name
System-on-a-chip design reduces failure rate by a factor of nine
Chalmers University of Technology, Sweden, announces that the European Union’s DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.
Off-axis silicon carbide substrate layering builds better semiconductors
Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.
Applied Materials VeritySEM 5i 3D metrology system enables 6 nm measurement
Applied Materials, Santa Clara, Calif., introduces the new VeritySEM 5i 3D metrology system, which provides imaging innovations in advanced e-beam technology and image processing.
Three-year U.S.-Ireland R&D initiative to develop advanced semiconductor materials
Tyndall National institute, Ireland, reports that a three-year U.S.-Ireland collaborative scientific project aims to reduce power consumption and increase battery life in mobile devices.