Have you published a scientific paper related to materials testing? Zwick will reward the most innovative use of a materials testing machine for ground-breaking research. The entry deadline is November 30, 2013. The development and use of new materials and technologies has always played an essential role. A substantial part of this development takes place in universities.
PhoenixTM develops thermal barrier for aluminum brazing
Phoenix Thermal Measurement, Clearwater, Fla., has developed a new thermal barrier designed for use in brazing aluminum parts. It addresses the problems of protection from hydrofluoric acid produced from chemicals in the flux combining with moisture within the thermal barrier, and oxygen in the air leaking from the thermal barrier that can “pollute” the nitrogen atmosphere inside the furnace.
SUSS MicroTec and Sematech partner to develop substrate and blank cleaning technologies
SUSS MicroTec, Sunnyvale, Calif., and Sematech announce that SUSS MicroTec’s photomask equipment division has partnered with Sematech to investigate and develop extreme ultraviolet lithography substrate and blank cleaning technologies that will accelerate process availability for extreme ultraviolet pilot line manufacturing.
IHEA announces 2013-2014 board and officers
The Industrial Heating Equipment Association, Taylor Mill, Ky., recently announced its 2013-14 Board of Directors and Officers. Serving as president (shown in the photo) is Tim Lee of Maxon, a division of Honeywell. Bob Green of Bloom Engineering was named IHEA Vice-President, and B.J. Bernard of Surface Combustion was elected Treasurer. Outgoing president Mike Shay of Elster Kromschröder, assumes the role of Past President.
New POL converter module series introduced
Allegro MicroSystems LLC, Worcester, Mass., released a new POL converter module series. The BR200 series are thin POL converter modules with an industry standard exterior shape and footprint that are responsive to very high speed loads and compatible with ceramic capacitors. These POL converter modules have been designed with higher efficiency, increased power density and are offered in a thinner package that most competitive solutions on the market today.