A working transistor requires an extremely thin insulating layer known as the gate dielectric. This layer sits above the semiconductor and helps control the movement of electrons. As transistors shrink, making this insulating layer thinner can improve electrical control. The difficulty is that adding such layers to atomically thin semiconductors can disturb the delicate interface […]
SMART Photonics has partnered with GlobalFoundries to offer a new open access foundry service combining GlobalFoundries’ silicon platform with SMART Photonics’ indium phosphide photonic integrated circuits.
Researchers at Lawrence Berkeley National Laboratory have developed a real-time 3D X-ray imaging technique to observe spacecraft heat shield ablation as it happens, improving how engineers model and design thermal protection systems for space missions.
Rigaku Corporation, Japan, a global solutions partner in X-ray analytical systems, launched the CT Lab HR160, a high-resolution X-ray computed tomography system for battery, semiconductor devices, electronic components, and advanced materials analysis.
TRUMPF, Germany, has developed the first industrial process of its kind using its HiPIMS products to coat microscopic structures in glass substrates, supporting the semiconductor industry in bringing next-generation high-performance AI processors to series production.
