Spirit AeroSystems Inc., Wichita, Kan., and Norsk Titanium Components AS, Norway, have reached a significant milestone in a multi-year collaboration for direct metal deposition technology. They developed an additive manufacturing technology that enables titanium components to be built up close to the final shape using titanium feedstock instead of a large titanium block. The process reduces waste, uses less energy, and is significantly faster.
HTS Members Receive ASM Awards
Four members of the ASM Heat Treating Society will be recognized this year at ASM’s annual Awards Dinner, Tuesday, October 29, Le Westin Hotel, Montreal, Quebec, Canada. Mr. William J. Bernard, Jr., FASM, President and CEO, Surface Combustion, Inc.
ISTFA 2013 Tools of the Trade: RKD/Left Coast Instruments
The history and process of dual acid decapsulation. This includes basic decapsulation techniques and the correct use of electrostatically dissipative tweezers and proper grounding relative to the Elite Etch Cu ESD decpasulation equipment.
Thermally conductive graphene can reduce computer processor temperatures by up to 25%
An international group of researchers, headed by Chalmers University of Technology in Sweden, has shown that graphene has a heat dissipating effect on silicon-based electronics. Graphene, a single layer of carbon atoms, is a very good heat conductor, ten times better than copper. Graphene has been shown to reduce temperatures in devices such as processors by up to 13 Celsius degrees, which not only improves energy efficiency, but also extends the working life of devices.
Modified paper repels water and oil
Paper is known for its ability to absorb liquids, making it ideal for products such as paper towels. But by modifying the underlying network of cellulose fibers, etching off surface “fluff” and applying a thin chemical coating, researchers created a new type of paper that repels a wide variety of liquids-including water and oil.


