Engineers at Oak Ridge National Laboratory, Oak Ridge, Tenn., have succeeded in consolidating ground graphite foam ligaments in titanium powder to make disks up to 7 inches in diameter with bulk thermal conductivity of 240 W/m-K, as well as high strength. The ground ligaments are about 500 microns thick and range in length from 100 to 200 microns.
Park Systems, Santa Clara, Calif., introduces Park NX-HDM, a fully automated atomic force microscopy (AFM) automatic defect review and sub-angstrom surface roughness measurement system for device substrates and disk media. The system increases throughput by up to 1000%, and offers a 30% higher success rate than prior systems. It analyzes, identifies, and scans media for all wafer sizes up to 150 mm.
Researches lead by Sara Tavassoli at Shahed University, Tehran, Iran, wanted to create a composite resin with antibacterial properties without reducing its mechanical and physical properties. “Zinc oxide nanoparticles were added to a preventive and treatment material and its antibacterial, mechanical, and physical properties were investigated at the same time,” she said. Adding zinc oxide nanoparticles to the resins increased the antibacterial properties.
Sulzer Metco, Switzerland, introduces MetcoClad, a robotics-based laser cladding system that can apply welded deposits on multi-dimensional surfaces in a single cladding run. The robust systems simplify operability, reduce production set-up time, and monitor the cladding process. Part manipulation can be tailored to customer requirements.
KLA-Tencor, Milpitas, Calif., introduces the 2910 Series optical wafer defect inspection platform with NanoPoint technology, and the eDR-7100 electron-beam wafer defect review system. Meeting the need for accelerated defect sourcing on advanced devices, these tools combine increased speed with seamless connectivity to quickly find and identify defects that inhibit yield and reliability.
