Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.
Nordson March plasma treatment systems designed for packaging applications
Photo-doping of semiconductor enables formation of new material phases
Researchers at Michigan State University, East Lansing, report that by shooting an ultrafast laser pulse into a semiconductor, its properties change as if it had been chemically doped.
Dense yttrium oxide coats electronic devices via suspension plasma spray
Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.
Picosun ALD technology enables uniform gold films on silicon wafers
Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.
Microindentation offers hope for high-throughput testing
Researchers at the Georgia Institute of Technology have developed a protocol using multi-scale modeling to determine tensile yield strength from microindentation tests. Micro indentation offers all the advantages of a high-throughput measurement technique.