Chalmers University of Technology, Sweden, announces that the European Union’s DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.
Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.
Applied Materials, Santa Clara, Calif., introduces the new VeritySEM 5i 3D metrology system, which provides imaging innovations in advanced e-beam technology and image processing.
Tyndall National institute, Ireland, reports that a three-year U.S.-Ireland collaborative scientific project aims to reduce power consumption and increase battery life in mobile devices.
Kay & Associates, Simsbury, Conn., will hold two intensive brazing-training programs this spring, the first in the Hartford, Conn., area (April 14-16), and the second identical program in Los Angeles (May 12-14).
