Alcoa, Pittsburgh, has agreed to acquire privately held TITAL, a German producer of titanium and aluminum investment castings for aircraft engines and airframes.
Amkor Copper, Chandler, Ariz., has available a copper pillar bump flip chip interconnect, which offers advantages in many designs while meeting current and future ROHS requirements.
Researchers at the University of Southern California, Los Angeles, have shown that films of black phosphorus can be used to make radio-frequency transistors, components found in many telecommunication devices.
CoorsTek Inc., Golden, Colo., has reached a definitive agreement with the Carlyle Group and Unison Capital Group to acquire Covalent Materials Corp., Japan.
SEMI, San Jose, Calif., projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3% to $38.0 billion in 2014, according to its year-end forecast.