A paper recently published in International Materials Reviews provides an insightful look at materials informatics and how it is being employed to overcome obstacles in computational materials engineering. “Data science and cyberinfrastructure: Critical enablers for accelerated development of hierarchical materials,” by Surya R. Kalidindi of the Georgia Institute of Technology, also identifies specific areas of research that offer the most promise based on the success of earlier work.
Low-cost 50-cm long carbon nanotube composite fibers produced for flexible electronics
Researchers from the Department of Materials Science and Engineering, Stanford University, have reportedly collaborated with researchers in China to produce polymer/carbon-nanotube composite fibers with lengths over 50 cm.
Materion offers high strength copper foils for electronics
Materion Performance Alloys, a Materion Corporation business, Mayfield Heights, Ohio, is preparing to meet increased demand for high-strength copper alloy strip products following the recent announcement by Mitsubishi Electric Co. that it will stop production of its copper alloy business effective March 2015.
Antireflective backside coatings are NIR optimized with no baking
Ultra Tec, Santa Ana, Calif., reports that its Arc-lite antireflective (AR) coating system coats package, board, and wafer level devices very rapidly, generally in less than one minute.
University of Chicago researchers develop compounds to join semiconductors
Researchers at the University of Chicago have reportedly developed compounds of cadmium, lead, and bismuth that can be applied as a liquid or paste to join two semiconductors or semiconductor pieces by heating them to several hundred degrees Celsius.