The future of materials discovery is here. Watch the fully automatic weighing and arc-melting system that can synthesize 1 alloy per hour (150 alloys per week). This is the first building block of “AlloyBot,” a self-driving laboratory to autonomously synthesize and test alloys 100× faster.
Intel foundry achieves breakthrough with world’s thinnest GaN chiplet technology
Intel Foundry has created the world’s thinnest gallium nitride chiplet, measuring just 19 micrometers thick, along with the industry’s first fully monolithic on-die digital control circuits built on a 300 millimeter GaN-on-silicon wafer.
‘Flawless on the outside, flipped within’: Detecting hidden defects in 2D dielectrics with light
A research team at Pohang University of Science and Technology, South Korea developed an interferometric second-harmonic generation imaging approach capable of optically identifying hidden structural defects in thin films of hexagonal boron nitride, a promising material for next-generation semiconductor technologies.
Researchers achieve the ‘impossible’ low-loss, tunable dielectric
A multi-disciplinary team led by Cornell University, Ithaca, N.Y., has developed a material that is both tunable and efficient, marking an achievement that was one of the most elusive goals in microwave electronics.
Sony and imec unveil high-density backside connectivity module enabling next-generation 3D chip integration
Sony Semiconductor Solutions, Japan, and imec, Belgium, have unveiled a high-density “local BDI” module for 3D chip stacking that allows through-silicon vias to connect through up to 500nm of bulk silicon, unlocking advanced logic and DRAM applications without needing to completely remove the silicon.